Assembly Options and Challenges for Electronic Products With Lead-Free Exemption
نویسندگان
چکیده
منابع مشابه
Lead-free Solder Assembly
Until non-lead solder conversion is mature, the evaluation of materials and components is likely to identify trade-offs. The performance of the no-clean andwater-soluble solder pastes that were tested varied widely. Ultimately each company will need to determine which attributes are most important for their product line. Also components needed for a product may not be currently available as lea...
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As the electronics industry begins to focus upon the tin-silver-copper family of alloys as a viable replacement for tin-lead solders, research needs to be done to determine if any particular alloy is best suited for the broadest range of applications. The tin-silver-copper family of alloys has earned a great deal of positive response from various industry consortia and organizations in recent y...
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The recent push for lead free products is resulting in significant changes in packaging materials. Manufacturers of electronic equipment are requiring materials that consistently withstand peak reflow temperatures of 240?C to 260°C. Reflow soldering at these ext reme temperatures, especially after extended moisture exposure, introduces several challenges that must be solved to produce reliable ...
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The combination of higher lead-free process temperatures, smaller print deposits, and temperature restraints on electrical components has created difficult challenges in optimizing the reflow process. Not only are the electronic components and the PWB at risk, but the ability to achieve a robust solder joint becomes difficult, especially if the PCB is thermally massive. In addition, the constan...
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ژورنال
عنوان ژورنال: IEEE Access
سال: 2020
ISSN: 2169-3536
DOI: 10.1109/access.2020.3010771